Sony hybrid bonding
由YKagawa著作·被引用35次—HybridbondingisamethodthatconnectstwosubstratesbyCu-Cumetalbondingandbyinterlayerdielectric(ILD)-.ILDoxidebondingatthesametime[2].The ...,2022年7月21日—Wafer-to-wafer(W2W)hybridbonding,whichinvolvesstackingthewafersface-t...
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...hybridbondingtechnologyanddiscussedwhat'stocomein2023andbeyond...Sony,thatbondpitchesassmallas2.2µmarecommon,andthetrendpoints ...
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